Smfl rit

 

Field by field alignment takes longer than global alignment because each die is aligned. Load wafers and cassettes correctly. 3, and Ar). microresist. 0 13500. Featuring a mix of dynamic and engaging alumni, faculty, and students, The World Tour provides intellectually curious alumni and friends of RIT the opportunity to engage in thought-provoking discussions on trending topics and critical issues. This will maximize the exhaust. 1. Abstract—The goal of this senior design project was to develop a DSA process for the RIT SMFL and enable further research and teaching opportunities. 2 10 O2 6 N2 Purge :05 25 10 N2 7 Ramp Down :35 25 10 N2 8 Unload 0 25 10 N2 Total Time 4:17 RIT SMFL S. o For this bench only, all cassettes, handles and beakers are to remain with the bench. Process Flow Summary Samples were acquired from Texas Instruments (TI), Veeco, and RIT alumnus Brian Romanczyk. 4. de Internet: www. 0 11500. Safety Data Sheet Material Name: Hydrogen UH PSDS ID: 00244243 * * *Section 1 IDENTIFICATION* * * Manufacturer Information MATHESON TAIGAS, INC. 2 5 O2 6 SOAK 2:25 1000. Onsemi’s recent gift, which includes naming rights to the Reactive Ion Etch (RIE) and Metallization Bay in the SMFL, is part of Transforming RIT: The Campaign for Greatness. The drip will begin as the 1. Identify personal safety hazards associated with the tool and what precautions are taken to prevent an accident from occurring. 2 10 O2 5 Soak 2:25 1000. This was the first time GaN was etched using this tool, and as such a new etch procedure needed to be developed to perform the etch. Hazards identification Storage :Protect from sunlight. 3 Press Load. • You must have an RIT identification card. SMFL-AR-032502 Tencor P2 § Processes o Certified users should be knowledgeable with the basics of stylus profilometry o Certified users should be able to select and configure appropriate fixturing for their measurement task o Certified Users should be able to write a measurement recipe appropriate for their measurement task CHEMICAL PRODUCT AND COMPANY IDENTIFICATION Product Identifier: JSR ARF ARX 2361J (R&D Use Only) General Use: Photoresist for Integrated Circuit Production Product Description: Photoacid generator and Poly(meth)acrylate polymer solution. Chemtrec USA Emergency: 800-424-9300 Chemtrec International Emergency: 703 at SMFL using the MEBES III E-beam system. The mist collector collects the mist from the dicing chamber. Using the SMFL's resources, CfD can fabricate detectors with custom process flows and multiple process variations. O'Brien 610C Polysilicon Deposition Rate and Uniformity 5 15 25 35 45 55 65 75 85 95 6/28/2003 1/14/2004 8/1/2004 2/17/2005 9/5/2005 3/24/2006 10/10/2006 Solution at RIT. oAn attempt was made to perform a reactive ion etch (RIE) of GaN for the firsttime at RIT. Download process data and recipes to floppy disk. Information department: Technical Office Email: djdc@djdevcorp. It needs to be turned on every time a wafer/workpiece is diced. com. How can a user hurt themselves? How can a user hurt the tool? A qualified user should be able to: Identify personal safety hazards associated with the tool and what precautions are taken to prevent an accident from occurring. Text may be added and replaced, new objects can be included, pages can be rearranged, watermarks and page numbers can be added, and so on. All the standard 4” processing tools available at SMFL were utilized to fabricate the devices. 6) Contact SMFL Staff and Dr. RIT SMFL Page 2 of 6 4 TOOLS AND MATERIALS 4. RIT management must approve chemicals and materials brought into RIT SMFL Page 1 of 6 1 SCOPE The purpose of this document is to detail the use of the Manual Processing Bench #2 for wet cleaning of silicon wafers. 7) Fill out an accident report if applicable. o Trained in after hours procedures. 490 Boston Post Rd Sudbury, MA 01776 USA. 3. Rochester, NY 14623-5603 585-475-2411 4) Call RIT emergency number X333 (53333) providing type of emergency and location, from cell 475-3333. 1. All users are expected to have read and understood this document. Have advisor sign for waste disposal if needed. Make sure that the lid is closed before spinning a wafer and avoid contact with resist. A nickel silicidation process has been developed for the Semiconductor & Microsystems Fabrication Laboratory (SM FL) at Rochester Institute of Technology (RIT). Grimsley 17-1511 Chemical cleared for use in SMFL SMFL Representative Date SDS on SMFL website _____ 512 SMFL 1000A Dry Ox Temp Gas Flow STEP DESCRIPTION TIME (ºC) (lpm) 0 Idle 0 25 0 1 Load 0 800 10 N2 2 Stabilize :20 800 10 N2 3 Ramp Up :20 1000. PI signs form in Section 1 B. 8 While the bath is heating up to 165C, occasionally stir it. of class 1000 clean room space, and provides fabrication resources for CMOS and MEMS devices on 100 & 150 mm SMFL-SDO-112509 Trion RIE. PDF Author: microe Created Date: Sep 1, 2008 · Karl Hirschman, who received a bachelor’s degree in microelectronic engineering from RIT and subsequently received his Ph. Gain an understanding of the benefits of ICP etching and how it works. 7 On the controller, press HOLD to remove the system from the hold state and begin heating. O'Brien RIT SMFL S. The main power supply is usually SMFL Beaker Training This information is from sections 5 & 6 of the SMFL SOP Basic Knowledge of Chemistry • Basic classes & incompatibilities o Organics, acids, bases, oxidizers – classed based on our safety, disposal purposes o Acid/base reaction o Solvent / oxidizer reaction o Sulfuric / Peroxide reaction privilege and may be revoked by RIT for cause at any time. This website contains general information about the SMFL and it's procedures. 01/15/2020 Rochester Institute of Technology Semiconductor & Microsystems Fabrication Laboratory Details for Each Mask Layer Design SMFL Use Plate # Delivery Order Mask Level Name Mask Level Design Layer(s) # Field Type (Clear or Dark) Minimum Suggestions and Comments. 02100-02199. The ADV- Join RIT’s President David C. 5um lines: Blank silicon wafer: 127 mJ/cm2: Aluminum wafer: n/a: Polysilicon on oxide wafer R I T 425C LTO Recipe DEPOSITION, RECIPE1 Time Step# ID (HH:MM:SS) Zone1 Zone2 Zone3 Tube MKS PressCk SiH4 O2 N2 Temp Analog Key 0 RESET 0:00:00 380 380 380 - - - SMFL-SDO-081908 CEE Coater CEE COATER CERTIFICATION CHECKLIST How can a user hurt them self? How can a user hurt the tool? A qualified user should be able to: Identify personal safety hazards associated with the tool and what precautions are taken to prevent an accident from occurring. 0 12500. Emergency telephone number: Kayaku Advanced Materials : 617-965-5511 Chemtrec USA Emergency : 800-424-9300 Chemtrec International Emergency : 703-527-3887. 5um of deposition, whenever switching deposition materials and at the end of your process. 4 Run Clean Recipe 6. This is the technology of choice for teaching circuit design and fabricating CMOS circuits at RIT. o A qualified user should be familiar with the process that will be done in the chamber. 2 Press Fast next to the tracking ball to light up the LED. Contact an SMFL staff member for assistance. References • Finish tool cooling water loop • Finish tool exhaust lines and connections • SMFL-SDO-010703 Bruce Furnace Operating Tool o Users should be able to: Load and unload wafers safely. RIT SMFL S. 6, sigma inner equal to 0. May 8, 2017 · An investigation of the ASML PAS5500 5X reduction i-line stepper and RIE systems capabilities of defining sub-300nm nitride sidewall spacers to create dense 200nm silicon FinFETs on a 400nm pitch has been experimentally undertaken in the SMFL at RIT. Note: Feb 10, 2023 · RIT is developing technologies to advance chip manufacturing and assembly processes and new materials discovery for future chips/circuits. Mechanical Hazards – Drive assemblies have sufficient power to cause injury. The Rutherford backscatter spectroscopy (RBS) technique was used to determine the specific nickel silicide phase(s) and thickness formed in the SfD and gate regions. 0 Created Date: 2/22/2017 2:01:48 PM count($values) / 2) AND $notsplityet) { echo ""; $notsplityet = false; } echo "{$val[attributes][NAME]} Jul 10, 2012 · The RIT Semiconductor & Microsystems Fabrication Laboratory (SMFL) has 10,000 sq. 6. R·I·T SEMICONDUCTOR AND MICROSYSTEMS FABRICATION LABORATORY. The older p-well CMOS and SMFL-CMOS have been phased out. RIT SMFL Page 3 of 11 4. Emergency phone number: Chemtrec (International): +1 703 527 3887. This is not a problem! We will upgrade it. Feb 10, 2023 · RIT is developing technologies to advance chip manufacturing and assembly processes and new materials discovery for future chips/circuits. Protect from sunlight when ambient temperature exceeds Semiconductor and Microsystems Fabrication Lab (SMFL) at RIT. The system will automatically reject any user who has an expired safety badge, after a two-week grace period at the beginning of each academic quarter. RIT is supporting two different CMOS process technologies. Title: 1631646. Load, end and abort a recipe. Grimsley. Completed form with all signatures is returned to T. RIT SMFL Page 5 of 15 6. 4) Complete Section 5 – Approved Users for Project Approval flow A. Failure to follow RIT will permanently shut down the RIT Wiki (Confluence wiki) on February 2, 2024. ft. Difluoromethane (R32) Section 2. Nitride depositions use hazardous gases and may not be run after 5:00pm. Use of the SMFL is limited to research and development as described in the LAB-USER’s project. Substrate: Dose to produce 0. Information department: Product Safety Email: productsafety@kayakuAM. 462 SMFL 1000A Dry Ox Temp Gas Flow STEP DESCRIPTION TIME (ºC) (lpm) 0 BOAT OUT 0 25 5 N2 1 Start :00:01 800 10 N2 2 PUSH IN :12 800 10 N2 3 STABILIZE :20 800 10 N2 4 RAMP UP :20 1000. These systems are utilized as part of RIT's role in AIM Photonics, to advance integrated photonics. Return completed form to T. Smith, Advisor, RIT. 2. count($values) / 2) AND $notsplityet) { echo ""; $notsplityet = false; } echo "{$val[attributes][NAME]} We’re looking forward to showing you around on a student-led virtual campus tour. Processes Do not exceed maximum rated operating specifications. The sheet resistance of nickel silicide in both regions was measured to Environmental Health and Safety Student Accident Report (To be completed by Student’s Instructor immediately following accident) Accident Incident Exposure (check one) Report Date/Time (Date form is filled out) _____ 3) Meet with SMFL Operations Manager for project review. SMFL-TG-091709 Branson Appropriate Uses o Only 100 & 150mm wafers are supported o No gold or copper allowed in the tool. Actual doses will vary depending on process conditions and resist thickness. 2 Hazards to the Tool 10. 0 o Candidate has SMFL Staff sponsor (student requirement only) o Consensus on candidate reached between SMFL management. Work outside the scope of the proposal requires an additional project proposal on file with RIT. This support is for both teaching Rochester Institute of Technology One Lomb Memorial Dr. Munson, Jr. Use the Graphical Analyzer to follow process parameters FILL OUT LOG SHEETS CORRECTLY! Store boats correctly. oThe LAM4600 RIE tool in the SMFL is traditionally used to etch Al films, but has the necessary gas hookups to etch GaN (Cl. In 2018, RIT launched the The SMFL is equipped with micro-fabrication and metrology equipment to support research programs in photonic devices, nanomaterials, semiconductor materials and devices, nano-electronics, MEMS devices and sensors. Mar 31, 2005 · These are approximate values. Design a timeline of a tool installation in a cleanroom. Contact a staff member. There are several HF-based etchants and the correct one must be used for proper etching. Office of the President. This interactive small group experience features video content of our beautiful campus and gives a unique inside look at our best-in-class labs and studios. o A continuous alarm may indicate a low level or a full waste bottle. Photoresist coating recipes usable on GaN pieces were developed for OiR-620 and LOR-5A photoresists, and About. Emergency telephone number: DJ DevCorp: +1 978 261-3188. edu if you need to retain your wiki and the project team hasn’t reached out. 2 10 O2 4 Stabilize :05 1000. Oct 28, 2014 · Read the P5000 Manual RevG - SMFL, a comprehensive guide for using the plasma etching system in the Stanford Nanofabrication Facility. O'Brien Photoresist Thickness & Uniformity for the SVG Track Rohm and Haas 1813 Photoresist 11000. in electrical and computer engineering from the University of Rochester, now serves as an associate professor in the departmentas well as director of the Semiconductor and Microsystems Fabrication Laboratory (SMFL LPCVD Process Notes : Set up for data collection: The furnace tube is heated up to the appropriate temperature and a full cassette of wafers is loaded. ACKNOWLEDGMENT The author would like to thank the RIT SMFL staff for all The user database in your gallery was created with an older version of the software and is out of date. Acknowledge inhibits. It is not a substitute for in-person training on the system and is not sufficient to qualify a user on the system. SMFL Cardswipe Access System • You must have a current SMFL safety badge. ACKNOWLEDGMENT The author would like to thank the RIT SMFL staff for all SMFL-SDO-121003 Wet Bench for Aluminum Etch Processes o A qualified user should be familiar with Aluminum etching and photoresist solvent strip. 3. It is recommended that the clean be run after every 0. edu. LEO Scanning Electron Microscope, Tenkor Profilometer, plasma vapor deposition trained and certified RIT-SMFL The RIT SMFL is now capable of depositing carbon hard masks which will allow for sub-lithographic patterning tech-niques like line-width trimming, while enabling reduction in reflectivity and improving existing processes. SMFL-SDO-080204 LAM 4600 Operating Tool o A qualified user should be able to: Start up the pumps and the dry scrubber in the service chase. o Track hang up during operation. Incompatibilities with Other Materials: Strong oxidizing agents, strong acids, strong bases, acid chlorides. Lamellar Directed Self-Assembly using PS-b-PMMA Block Copolymers. oIn order to qualify this etch, the tool owner needed A nickel silicidation process has been developed for the Semiconductor & Microsystems Fabrication Laboratory (SM FL) at Rochester Institute of Technology (RIT). Title Section 3, 4, & 5 will be filled out by SMFL, you will be notified of procedures / equipment to be used. RIT . Information department: Product Safety Email: productsafety@microchem. RIT SMFL Page 2 of 4 5 REMOVING A WAFER 5. SMFL-TJG-091709 P5000. The SMFL is always looking for ways we can improve. o Al, Ta, W, Mo are allowed. MANUFACTURER: EMERGENCY TELEPHONE NUMBERS: JSR Micro, Inc. SMFL-SDO-060304 Karl Suss MA56 Karl Suss MA56 Mask Aligner How can a user hurt themselves? How can a user hurt the tool? A qualified user should be able to: 1. 1 The SpectraMap SM300 is a film thickness measurement tool that can map an entire wafer. Do not place hand over wafer end-station when operating RIT SMFL Page 1 of 2 1 SAFETY PRECAUTIONS 1. 00 15 20 2 DSP 1 2 n/a 1. 2 Spinning Wafers - Wear safety glasses at all times. 5) Be available to meet with RIT emergency crew, if chemical involved provide SDS. CHEMTREC: 1-800-424-9300 1280 North Mathilda Ave Semiconductor & Microsystems Fabrication Laboratory Uses advised against Details of the supplier of the safety data sheet Company name:micro resist technology GmbH Street: Koepenicker Str. • SMFL Project is assigned and setup in cardswipe system • Users identified on form will be enabled on project. Our primary mission is to support our customers in the lab and we are always open to ideas on how we can make things better. 7 Wafer Field by Field Alignment – This method uses marks that are part of the CAD data for each mask layer; they are not exposed individually. (student MicroChem Corp. 1 General Description 4. Simply flip the switch and turn on the valves as shown in in the below figure. When you're done editing, click Done and then go to the Documents tab to combine, divide, lock, or unlock the file. Fig. for these upcoming stops on TRANSFORMING RIT: The World Tour. These values were obtained using the SMFL Coat Program with a resist thickness of approximately 9,250A. Product identifier. The tool is capable of measuring multiple layer films if the thicknesses of the lower films are known. 00 15 20 3 SPIN 1 60. The SUB-CMOS process is used for standard 3 Volt Digital and Analog integrated circuits. 1 Chemical Hazard - Read the materials safety data sheets for the materials that will be used. 4 Using the Measurement Software1. 0 12000. Relocate and Reinstall CVC Thermal Evaporator. O'Brien Exposure Doses for the GCA Stepper Fujifilm HPR-504 Photoresist Coated on SVG Track 0 20 40 60 80 100 120 140 160 180 200 9/20/2004 4/8/2005 10/25/2005 5/13/2006 11/29/2006 6/17/2007 1/3/2008 7/21/2008 Date Energy mJ/cm2 Dose to Clear on Silicon mJ/cm2 Dose to 1um Line on Silicon mJ/cm2 SMFL-TG-110701 CVC 601 \2001 Work\2001 RIT\Operations\Certification\Checklists\601 Certification checklist. Stability and reactivity. RIT SMFL 11/25/2009 Coat Track Programs Program 1- Standard Coat Event Operation Arm Time(sec) Speed(krpm) Accel(krpm/s) Exhaust(x10 LPM) 1 SPIN 2 2. 2, BCl. Do not attempt to refill bath. Jacob P. Keep hands, fingers, clothing and tools clear of moving parts. 1 HMDS Prime 140C Event Operation Time Gap 1 VBAK 30. 2 5 O2 5 STABILIZE :05 1000. D. Led by live student tour guides who will know you by name, you’ll have the opportunity to get your Created Date: 4/3/2013 9:07:22 AM Project Goals. ITS is migrating non-CTL wiki spaces with a business need to continue using their wiki to the Confluence Cloud wiki. 6 Open the vent behind the tank that you will be using and close the other vents. O'Brien Photoresist Thickness & Uniformity for the SSI Track Arch 620 Resist 7500 8000 8500 9000 9500 10000 10500 10/21/02 3/4/04 7/17/05 11/29/06 4/12/08 Edit smfl visitor agreement 1109. pdf Author: tjg1485 Created Date: 10/15/2015 1:26:58 PM The mesa etch was performed on the SMFL’sLAM4600 Reactive Ion Etcher. Kayaku Advanced Materials 200 Flanders Road Westborough, MA 01581 Tel: (617) 965-5511 Fax: (617) 965-5818. The primary mission of the facility, since its completion in 1986, is to provide support to the academic programs in microelectronic engineering. 4 The intensity should be adjusted to give a good picture on the screen. Emergency telephone number: MicroChem Corp : 617-965-5511 Chemtrec USA Emergency : 800-424-9300 Chemtrec International Emergency : 703-527-3887. Do not remove or alter the position of X-ray shielding installed in any part of the implanter. Welcome to the SMFL The Semiconductor & Microsystems Fabrication Laboratory is located in RIT's Kate Gleason College of Engineering The SMFL is host to many RIT undergraduate and graduate classes as well as meeting the needs of both internal and external researchers. Learn how to operate, maintain and troubleshoot the equipment. 0 2 PRIME 20. of class 1000 clean room space, and provides fabrication resources for CMOS and MEMS devices on 100 & 150 mm silicon substrates. Please email completed gds files to Sean O’Brien, sdoemc@rit. Process a wafer. 2 10 O2 7 N2 PURGE :05 25 15 N2 8 RAMP DOWN :35 25 10 N2 Total Time 4:17 RIT SMFL S. The objective of this project was to achieve lamellar structure RIT STOICHIOMETRIC NITRIDE Recipe DEPOSITION, RECIPE1 Time Step# ID (HH:MM:SS) Zone1 Zone2 Zone3 Tube MKS PressCk SiH2Cl2 NH3 N2 Temp Analog Key 0 RESET 0:00:00 380 380 380 - - - SMFL-SDO-080508 MOS GRADE RCA Bench o If a new HF bath is necessary, contact the process or equipment technician. Safety badges are valid for a period of one year after they are issued. These marks may be placed in the scribe lanes. Manufacturer/Supplier: DJ DevCorp. 0 13000. Fig 1. Reporting Analyst. The sheet resistance of nickel silicide in both regions was measured to RIT SMFL Page 4 of 7 6. 5. Office of Diversity & Inclusion. TRION MINILOCK RIE CERTIFICATION CHECKLIST . Decommission the PE 2400 Sputtering System. The ten Jul 13, 2015 · The picture should appear on the monitor behind the scope. Conditions to Avoid: Ignition sources, moisture, excess heat. Details of the supplier of the safety data sheet. A total of 10 device wafers and 5 control wafers were fabricated in the process. Hirschman. Maskmaking Order Request Rochester Institute of Technology The SMFL will take care of the 5x scaling for the ASML and GCA steppers. The following people have access to the main SMFL Lab Staff on this list are allowed 24/7 access without a "buddy" · Normal Off Hours access is M-F 7am to 8am & 5pm to 12am and Sat & Sun 8am to 12a RIT SMFL S. In addition, x 67000-67899. 00 15 20 4 END Prog. 02000-02099. 0 5. de. All gas lines must be completely pumped out by that time. 0 1. 100 Park Point. Appropriate Tool Use. Processes. Date:_____ OHS Requirements o SMFL user with active project in lab – student has been active for at least two quarters prior o Certified Operator on two Base Level Tools. Chemical Stability: Stable at room temperature in closed containers under normal storage and handling conditions. In 2018, RIT launched the not previously available at the RIT SMFL (Current use of LAM 4600 Reactive Ion Etcher (RIE) for etching on Si) • Tool installation experience will be relevant to student’s full-time employment 200 nm. Install ICP Etcher, Auxiliary Equipment. 150 Allen Road, Suite 302 Basking Ridges, NJ 07920 The RIT SMFL is now capable of depositing carbon hard masks which will allow for sub-lithographic patterning tech-niques like line-width trimming, while enabling reduction in reflectivity and improving existing processes. 1 Set the objective lens back to 1 to avoid wafer damage. Execute a furnace run. O'Brien Stoichiometric Nitride Deposition Rate and Uniformity 1 6 11 16 21 26 31 36 5/24/2002 12/10/2002 6/28/2003 1/14/2004 8/1/2004 2/17/2005 9/5/2005 3/24/2006 10/10/2006 Jul 1, 2012 · The RIT Semiconductor & Microsystems Fabrication Laboratory (SMFL) has 10,000 sq. Give the file a name, type andlocation. The lab's flow bench and probe stations offer wafer-level testing, even during the fabrication process, allowing mid-process design changes. The RIT III-V EPICenter is a III-V materials growth facility capable of providing small-batch epitaxial services. 4 Turn off the vacuum and remove the wafer. Turn on the valves that connect the mist collector to the dicing saw outlet. The wafers obtained were standard 4” wafers with resistivity ranging from 8-12 ohm/cm. 5 To capture a picture select CTRL P on the keyboard. 200 nm. 1 A clean recipe is used to prevent buildup and flaking of material from the chamber lid and is critical to obtaining good process results. Semiconductor & Microsystems Fabrication Laboratory SMFL-SDO-102518 SVG 1 Track Simple Errors o Avoid removing wafers that are wet with developer. The autoloader is not currently being used and wafers should be loaded manually. SMFL Beaker Training This information is from sections 5 & 6 of the SMFL SOP o Only RIT personnel approved to purchase chemistry may do so. Please email pmo@rit. Load and modify a recipe. RIT-SMFL Issued Jan 2015. NISI and Ni2Si were obtained in doped source/drain and polysilicon gate regions respectively at rapid thermal annealing (RTA) condition of 500°C for 60 seconds. 1 Hazards to the Operator 1. 3, CHCl. Kupernik, Student, RIT, Thomas M. 325 Place: D-12555 Berlin Telephone: +49 30 641670-100 Telefax:+49 30 641670-200 e-mail: safety@microresist. Government and Community Relations, RIT Newsletter, & Athenaum. 200 Flanders Road Westborough, MA 01581 USA. Since its beginnings in the 1970s, growth of thin films of epitaxial crystals has proven to be extremely successful in manipulation of the fundamental optical, electrical and magnetic properties of materials. O'Brien 5000A Dry Oxide Tube 6 - Program 606 4500 4600 4700 4800 4900 5000 5100 5200 5300 5400 5500 9/20/2004 11/9/2004 12/29/2004 2/17/2005 4/8/2005 5/28/2005 7/17/2005 9/5/2005 10/25/2005 12/14/2005 . Mary Merkel. 5 If no one else needs to use the microscope, turn off the Illuminator Power Supply, press the RIT SMFL 2pm NMOS process was used to fabricate transistors in which nickel silicide was formed in the source drain as well as the polysilicon gate region. The work presented in this project involves photoresist over-exposure through annular illumination with NA equal to 0. 1 Open the ImageJ software. Set up endpoint detection and data acquisition on. 5 SAFETY PRECAUTIONS RIT SMFL Page 3 of 10 2. up eo dv oq of ae vn oc wf jk